The Integrated Photonics Cleanroom is a 200m² Class 1000 facility with local areas of Class 100, designed for planar processing of a very wide range of materials. The prime purpose of this facility is to be able to take raw materials, ORC-made materials, or commercial materials and process them to realise photonic devices for use in applications from telecommunications to all-optical data processing and from biochemical sensing to the lab-on-a-chip. Polishing and scanning electron microscopy are available outside the cleanroom. The major equipment items are: Karl-Suss MA6 double-sided mask aligner, OPT Plasmalab 400 Sputtering Machine, Ionafab 300 Plus Reactive Ion Beam Depostit/Etcher, Edwards Auto 306 thermal evaporators, Edwards Auto 306 electron beam evaporator, Materials Research 2300c Furnace, Severn (STS) 1200c Tube Furnace, Instron 600c Ion-Exchange Furnaces, KLA Tencor P-16 Stylus Profiler, Nikon LV100D Optical Microscope and Wet Benches for Chemical Processing.
Nano 38 Sputting Machine Lesker Sputter System
Three Zone, Bench Top 1700C Tube Furnace
This furnace is capabale of reaching 2300C in rough vacuum or 1600C in oxygen.
Allows ion-beam milling of materials to produce etched structures following photolithography, for example. May also be used for reactive or chemically-assisted ion-beam etching, and for ion-beam deposition of materials from a target
Ionfab 300 Plus / Load Locked Ion Beam Etch System
BOC Edwards Auto 500 electron beam evaporation systems can deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. Very fast deposition rates can be achieved using electron beam evaporation. Electron beam sources can hold more evaporant than resistance sources which allows the deposition of thick films and multiple coatings before the need to refill the electron beam source
Auto 500 Electron Beam Deposition System
Allows RF magnetron sputter deposition of dielectrics and metals in inert or reactive environments. 150mm diameter sputtering targets yield good uniformity over a 100mm wafer. Materials such as silica, germania-doped silica, alumina and tantalum pentoxide are routinely deposited. An additional Kurt Lesker Nano 3 sputterer is available for novel glass films.
Plasmalab System 400 / Magnetron Sputtering System
Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer
The Alpha-Step IQ stylus-based surface profiler combines high measurement precision with versatility and economy. Ideal for semiconductor pilot lines and materials research, this advanced surface profiler enables faster process learning and higher yields. With guaranteed 8Å (1 sigma) or 0.1% step height repeatability and sub-angstrom resolution, the Alpha-Step IQ surface profiler provides excellent repeatability and performance to analyze and monitor processes.
The P-16+ stylus profiler is a surface metrology analysis solution. This surface analysis solution`s precise force control provides excellent vertical resolution, precision, and reliability measurements. This surface analysis solution delivers automated step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials
The Frontier¿ IR/NIR system enables you to benefit from faster method development and reduced instrument costs. This single optimized system provides unique mid-IR and near-IR dual range performance. Automated range switching, at the touch of a button, enables you to quickly move onto your next sample without manual reconfiguration, increasing your productivity.
GX Custom FT-IR Spectrometer (obsolete 1718)
Designed to meet the exacting requirements of wafer, flat panel display and optical inspection and fabrication. The ABL/ABLH9000 incorporates an active preload on both vertical and horizontal surfaces. The opposing thin-film pressure maintains the bearing nominal gap tolerance. This design, in addition to the large air-bearing surface that distributes the load over a large surface area, results in a stage with outstanding stiffness that is ideal for heavy or offset loading.
Parallel plate RF etcher for glass etching primarily using SF6 and CHF3. Can also be used for ashing using O2.
Plasmalab 80 Plus / Compact Modular Plasma System
ZeMetrics ZeScope Optical Profiling System
Flame Hydrolysis Deposition Chamber - 1 of 2
Flame Hydrolysis Deposition Chamber - 2 of 2