The Southampton Nanofabrication Centre is a state-of-the-art facility for microfabrication and high-spec nanofabrication, as well as a wide range of characterisation capabilities housed in the new Mountbatten Complex at the University of Southampton. One of the premiere cleanrooms in Europe, the Centre has a uniquely broad range of technologies, combining traditional and novel top down fabrication with state-of-the-art bottom up fabrication. This allows us to develop and produce a wide range of devices in diverse fields such as electronics, nanotechnology and bionanotechnology and incorporate them into an equally comprehensive array of nano and microsystems for analysis and use. The characterisation capability is similarly extensive catalogue of microscopes and test gear, from nanometre resolution scanning microscopes to electrical, magnetic and RF analysis. A detailed equiment list can be found at http://www.southampton-nanofab.com/machineDatabase/
School of Electronics & Computer Science
X-ray fluorescence (XRF) analysis of glasses & high sensitivity trace analysis, spatial resolution 50um, sensitivity element dependant, down to 50ppm
The HELIOS sputtering tool is a flexible platform for fast, precise and fully automated thin film coatings. It specializes in high quality optical coatings featuring very low absorption and scattering. Optical performance is ensured by the extremely dense, smooth, stoichiometric, and amorphous layers. Precision in layer growth control is facilitated by an optical monitoring system for in-situ on-substrate measurements.
Sub 100nm spatial resolution imagaing of distribution elements in a sample. Spatial location of lements in an alloy, imaging of contacts under metal, semiconductor metal failure analysis, analysis of layered structures.
Cleaner/lift-off/stripper module/developer module. 4,6,8 inch wafers, 5.6.7 inch plates.
Resistance evaporation source for filament or boat evaporation. A built-in shield prevents unwanted coating of the vacuum chamber and adjacent deposition accessories. Four position turret evaporation source capable of sequentially depositing up to 4 different materials without breaking vacuum. Sources are selected and rotated into the evaporation position using a simple handwheel control. The sources can be configured to evaporate from the center or the side of the vacuum chamber for optimum film thickness uniformity onto a choice of static or rotating substrate fixtures.
Rapid prototyping machine, build resolution x-axis 600dpi/42um, y-axis 600dpi/42um, z-axis 1600dpi/16um, build size XxYxZ) 342 x 342 x 200mm, input formats STL, IPT, IAM, SLC and objDF files. Two resin setup VeroWhite (hard) and VeroBlack (soft), capable of producing parts of any hardness level by mixing both resins.
The Zeiss Orion helium ion microscope has similar functionality to an electron microscope, but uses a focussed beam of helium ions in place of the electrons. The larger mass and therefore smaller de Broglie wavelength of helium ions compared to electrons means that the scanning helium ions microscope suffers less from diffraction effects than a scanning electron microscope (SEM). Since helium ions can be focused into a smaller probe size and provide a much smaller sample interaction compared to electrons, the Orion generates higher resolution images with better material contrast and 5 times improved depth of focus. The high resolution arises from the use of a finely sharpened needle and a process that strips individual atoms away from the source until an atomic pyramid is created with just three atoms at the very end of the source tip. The Orion achieves a resolution of less than 0.9nm at an energy of 25-30kV and can deliver beam currents between 1fA and 25pA.
AQ317 Spectrum Analyser (purchased in 1999)
The Theta Probe X-ray Photoelectron Spectromer (XPS) allows the collection of angle-resolved spectra without the need to tilt the sample to nondestructively characterize ultra-thin layers.
Theta Probe Angle-Resolved X-ray Photoelectron Spectrometer (ARXPS) System
High resolution FEG-SEM for sub 100nm imaging. Magnification x100 to x1000000
Field Emmission Scanning Electron Microscope (FEG-SEM)
LAB700 e-gun evaporator incorporates 2e-guns each with a 5xcrucible plate. is configured for reactive ion assisted deposition of dielectrics, high precision lift off, variable angle deposition, cryogenic deposition
The MultiView 4000 is a multi scanning probe system with an open platform for integration with a Raman spectrometer. The system is configured for dual probes set-up that allows multiple probe SNOM measurement and other SPM imaging. The system is also configured for optical waveguide device characterisation.
Nanonics Hydra SPM/SNOM System (Multiprobe System)
Lyncée Tec¿s DHM T1000 series is composed of the only transmission configured optical profilers on the market. Based on Digital Holographic Microscopy technology, its contactless full-field 3D optical topography performed at video rate makes it an ideal tool for quantitative dynamic and static measurements.
Control box for Coherent RegA, used for optimising cavity injection and ejection timings
Upright 8" yellow room microscope, 5M camera, 5x to 150x objectives, Nomarski
BAK600 e-gun/thermal evaporator is configured for non-reactive deposition of metal contact stacks , metal masking layers, some dielectrics, ITO.
Coolpower 4.2Gm Two Stge Systems (Obsolete/Decommissioned YE 15/16 - per YY 04/08/2016)
The etching plasma is created by an RIE RF source and RF induction magnetic coil to produce high plasma densities. The results are high etch rate, high aspect ratio, and anisotropic etching of material of the samples. The system can also operate in ICP or RIE mode separately. This system is configured for fluorine-based chemistry etching. Ideal for deep oxide etching, silicon nitride, polymer, poly-silicon, amorphous silicon and crystalline silicon.
The etch mechanism of RIE is achieved by using the reactive gas plasma generated by strong RF source (13.56 MHz) to chemically ion etch the material of the samples. Depending on the process recipe, the material⿿s etched profile can achieve high anisotropy. The DP06 RIE80+ system is configured for multimaterial etching like silica, silicon nitride, polymer, III-V based, semiconductor-metal, polysilicon and amorphous silicon.
The EVG 620 provides high precision manual alignment on wafers. This is the main maks aligner of the cleanroom and can handle wafer sizes up to 150mm. Exposure can be performed in hard, soft and proximity modes.
150mm wafers, automated loading, dru oxidation 600-1150C, wet oxidation 600-1150C, anneal 600-1150C, temperature accuracy +/- 1C, 25 wafer boats.
Parallel angle-resolved XPS (PARXPS) analysis without sample tilting, ability to collect angle-resolved XPS spectra over a 60 degree angular range, in parallel, without tilting the sample and allows the instrument to characterise ultra-thin films non-destructively, allows composition depth profiling using an integrated etching module, X-ray monochrmator with user-selectable spot size in the range 15um to 400um,. Ability to handle large or multiple samples, CCD sample alignment microscope perpendicular to the sample surface.
10W solid state Coherent Verdi-10, continuous wave pump laser, used for pumping Mira 900
Ionfab300Plus is a modular System designed for ion beam etching. It is used in a wide variety of processes, particularly in the Semiconductor and Optical Coating Industries.
The focussed ion beam (FIB) is a multi nanofabrication tool system capable of performing sophisticated nanomachining, in-situ metal or insulator deposition, lithography and metrology analysis. This versatile system is based on the dual ion and electron beams column concept, which allows it to perform ionic nanofabrication function while imaging using the scanning electron microscope. The liquid metal ion source (LMIS) for the system is gallium and it is integrated to an ionisation tungsten tip to produce a fine and high resolution ion beam. The additional features in the FIB are ion and electron beam induced deposition using gaseous metal-insulator sources.
The Caliber is a versatile and high performance SPM system designed for multifunctional and routine microscopy of surface topology, polymer, biomaterials and semiconductor materials. The compact design and user friendly interface make it a suitable educational tool as well as for research activity.
The FlexAl system allows the deposition of ultra-thin layers (typically a few nm) of a variety of metal oxides and nitrides from liquid precursors. The deposition process works by providing a short pulse of precursor, followed by purge and exhaust steps. This cycle is then repeated to build up a layer. Typical growth rates are around 1A/cycle. The system is currently configured for the deposition of ZnO and Al2O3. ZnO is deposited using a DEZ precursor. The deposition rate is typically 1A/cycle at 150C. The refractive index of ALD ZnO varies from 1.75 at low temperature to 1.83 at high temperaure, compared with 1.985 for bulk ZnO. Annealing at 425C (not optimised) can help improve electrical properties.
Upright 6" bioMEMS microscope, 5m camera, display & software, 5x to 150x objectives, Nomarski
The etch mechanism of RIE is achieved by using the reactive gas plasma generated by strong RF source (13.56 MHz) to chemically ion etch the material of the samples. Depending on the process recipe, the material⿿s etched profile can achieve high anisotropy. The DP01 RIE80+ system is configured for etching of polysilicon, amorphous silicon, silica, silicon nitride and polymer. 13.56 MHz driven parallel plate reactor Substrate electrode: 170 or 240 mm Shower head gas inlet optimised for RIE High conductance vacuum layout Gases: CHF3, Ar, O2, SF6, CF4, N2
Cascade Microtech prober, 4 x DCM 210 positioners, Agilent 4155C Semiconductor Parameter Analyser, Agilent 4279A 1MHz CV meter, Agilent E4443A sHz-6.7GHz spectrum analyser, Agilent MXG N5181A analog signal generator 250 KHz-1 GHz
Plasma Enhanced Chemical Vapour Deposition (PECVD) system for the growth of amorphous and polycrystalline Si, SiGe and Ge layers. The layers can be doped during growth either n-type (using PH3) or p-type (using B2H6), thereby allowing p-n junctions to be formed. Amorphous silicon uses SiH4 for the source of silicon and CF4 & O2 for cleaning. The growth temperature is typically 250C, giving a growth rate of around 25 nm/min. Stress in the deposited layer is typically <200Mpa. Polycrystalline silicon uses SiH4 for the source of silicon and CF4 & O2 for cleaning. The growth temperature is typically >=610C. The growth rate at 610C is ~2 nm/min and at 650C ~ 20nm/min. Microcrystalline silicon uses SiH4 for the source of silicon and CF4 & O2 for cleaning. The growth temperature is typically in the range 585 - 610C, giving growth rates in the range 1 - 2 nm/min. Amorphous and polycrystalline germanium use GeH4 as a source of Ge and CF4 & O2 for cleaning.
The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput.
Control box for Mira 900F, used for mode locking and monitoring of output power
Semi-automatic 200mm probe station with micro-chamber, temperature control -65-200C. 4x67GHz infinity probes, eVue digital imaging system
EVG501 Semi-Automated Lamination Machine
1000x Direct Diode Laser Serial No. 330739 (purchased in 2003)
Optical Component Characterization System
The QDI 302 Microscope Spectrophotometer is designed to add spectroscopy and imaging to your optical microscope. It can also be used to upgrade a legacy microspectrometer or to add spectroscopic and film thickness capabilities to a probe station. The QDI 302 attaches to the microscope, microspectrometer or probe station and enables you to collect transmission, reflectance, polarization or even fluorescence spectra of microscopic samples. Depending upon the microscope optics and sources, the spectral range is from the deep UV to the near infrared region. With the QDI 302, high quality spectra of even sub-micron samples can be acquired non-destructively and with ease.
Desposition vaporator system. Evaporates commonly used metals (such as aluminum, chromium, silver, gold and many others).
Femtosecond optical charecterisation system, coherent laser, CCD camera & optics.
Wafer scribing tool, Vanadium Fibre Laser (1064nm wavelength, 0.25mJ pulse energy, 25um spot size), up to 5000 mm/s scanning speed, programmable z-axis, 245 lens upgrade allowing 220mm diameter field size, vision system for lase focusiing
Particle measurement tool, 150mm substrates, sub micron particles down to 0.2um, measurement time 30 sec on 6" wafers, particles sensitivity 0.2um diameter latex spheres, haze sensitivity 0.4ppm, spatial resolution 50um spacing minimum, measurement range 0.004um and 102um in twelve ranges and 256 gradations.
The CT 500 range of twin column, computer controlled universal materials testing machine using Testometric's feature-rich winTest¿ software running under the Windows¿ operating system. Test setups are fully configurable and simple or more complex multi-stage test routines are controlled using the standard PC serial interface.
Modified Material Testing Machine (M500-100CT)
The AQ6370 is Yokogawa`s high speed and high performance Optical Spectrum Analyzer for characterization of optical communications system and optical components. - High wavelength resolution: 0.02 nm - Wide close-in dynamic range - Single Mode and Multimode fiber test capability, via the same optical input:up to GI 62.5/125nm. - Pulsed light measurement capability
The AQ-6515A/-6315B optical spectrum analyzer brings advanced capabilities to a wide range of applications, from light source evaluation to measurement of loss wavelength characteristics in optical devices.
Optical Spectrum Analyser (Yokogawa AQ6315A)
150mm wafers, manual loading, general furnace, temperature accuracy +/- 1C, 25 wafer boats.
3D MEMS dynamics and topography tester. Scanning laser vibrometry for out of plane vibrations up to 20MHz, stroboscopic video microscopy for in-plane motion & vibrations, white light interferometry for surface topography http://data.southampton.ac.uk/equipment/E10277.html
Scribing of Si, glass & brittle materials. Scribing of glass in all directions with auto alignment function, handles up 300mm substrates with a thickness up to 2mm.
150mm wafers, temepratures from 400-1000/1200C (pyrometer), 400-1000C (thermocouple), times from 5s to 10mins, temperature accuracy +5c, temperature reproducibility
Jetfirst 200 Rta / Jetfirst 200 Rta No Pump
Measures roughness, waviness, step height and wafer stress, 2D and 3D fully autiomated data scans, sequencing capable, up to 8" substrates, vertical features from 100A-300um with a vertical resolution down to 0.5A.
Spectral range 190nm-1999nm, 200mm computer controlled sample positioning, auto angle of incidence
150mm manual probe station, 6 probes, Leica S6 stereo zoom microscope, 0.6-4xzoom, 30 x eyepieces
Cascade Microtech M150 Mulitpurpose Probing System
Ultrasonic wedge bonder, AI and Au wires (25um), minimum bond pads 50x50um2, bare silicon bonding, programmable individual bonding parameters.
Grazing Incidence Vuv Spectrometer / Interface For Reading Images
Offers precision fusion splicing and fused fiber components critical to high-power fiber laser performance. This includes creating combiners and tapers, large mode area (LMA) fiber splicing, photonic crystal fiber (PCF) splicing, and large diameter fiber splicing with low loss.
Fibre Tapering & Bundling System (obsolete 1718)
The Laser2000 range of picosecond lasers contains both high and low power lasers to cover a wide range of applications. The picosecond pulsed diode lasers and picosecond LED modules are particularly suitable for biomedical applications. High power picosecond lasers designed for industrial microprocessing offer a new level of precision and versatility.
UV/VIS/Near IR spectrophotometer used for Absorption, Transmission and Reflectance measurments from 190 - 2500nm
Ex Demo V-570Pc Spectrophotometer System
A 30KV, LaB6(or tungsten filament) scanning electron microscope equipped with an Everhart-Thornley secondary electron detector and a cambridge four quadrant backscatter detector. Maximum resolution is 10nm depending on column conditions.
Leo 1455VP Scanning Electron Microscope (SEM)
Red Optics And Lens Mounts – Part of the FRODOSpec for the Liverpool Telescope in the Canary Islands
Analysers/Generator - 3 Items Each Over £25K
The Gatan XuM utilises the electron beam in an scanning electron microscope to generate X-rays which are projected through a sample and onto an X-ray camera to form an image. This provides non-destructive imaging of the internal structure of suitable samples. The sample can be rotated and re-imaged multiple times to build up a tomographic dataset from which a 3D reconstruction of the sample can be generated. The resolution limit of this technique is ~400 nm.
Gatan X-ray Ultramicroscope (XuM) (accessory for the EVO SEM LS25 microscope)
Orion Variable Accelerating Voltage Package
Build into a confocal optical microscope
Ar Ion laser (352nm and 364nm). 80mW laser power class 3B. Mounted to direct write lithography system. Local ID: PH/1895
Solar simulators provide a broadband spectrum close to that of the sun from the UV to the IR. The main part of the solar simulator is a xenon arc lamp that reaches a color temperature of almost 6000K which is very close to sun light. We provide solar simulators with a wide range of luminous fields for different sample sizes and budgets, varying in size from 25 mm to 260 mm x 260 mm in diameter. The irradiance (W/m²) depends on the size of the desired output beam, the lamp¿s power input and the layout of the simulator¿s optic. The spectral characteristics are always the same.
CCD Sensor (S/N 01412-01-01)–Part of the FRODOSpec for the Liverpool Telescope in the Canary Islands
Bridgeport Model Vmc 800X Vertical Machining Centre
Provides cooling water for Beamlock 7W Argon Laser E10500
Recirculating Water Chiller for Beamlock 7W UV Argon System (E10500)
Orion Liquid Nitrogen Cooling Dewar System
Vitesse Duo are diode-pumped solid-state lasers using a 10W Verdi CW laser to both seed the Vitesse ultrafast oscillator and pump the RegA. The result is a compact and economical, 2-box, all-solid-state solution for high repetition rate, ultrafast amplification.
The EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. Volume production types and manual R&D systems are available. An ultra-soft wedge compensation together with a computer controlled contact force between the mask and wafer ensures that both yield and mask lifetime are dramatically increased while production costs are lowered. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers.
Designed to provide the widest range of process variations, the EVG100 series` modularity accepts spin and spray coating, developing, bake and chill modules to suit your individual production requirements. These systems accommodate the processing of an extensive range of materials such as positive and negative resists, polyimides, double-sided coating of thin resist layers, high viscosity resists, and edge protection coatings.
EVG150 Automated Resist Processing System
CCD Sensor (S/N 01502-22-02)–Part of the FRODOSpec for the Liverpool Telescope in the Canary Islands
These systems are actively-damped tables onto which senstive pieces of equipment can be mounted to isolate them from vibrational interference. These are current employed underneath the Zeiss Orion Helium Ion Microscope, the Zeiss Nvision40 Focused Ion Beam and the Zeiss EVO Scanning Electron Microscope.
The scanning electron microscope (SEM) is used to examine microscopic topographical or compositional detail of solid specimens. The image is produced by scanning an extremely small focused beam of electrons (adjustable down to a few nm in diameter) across the surface of a specimen in an array of picture points; high-energy electron bombardment of the specimen causes signals to be emitted at each position of the beam. These are collected and their intensities are used to produce images of the specimen by modulating the brightness of equivalent pixels on a computer screen. An SEM has three distinct advantages compared to a light microscope - better resolution, greater depth of field and the ability to carry out X-ray microanalysis. The Zeiss EVO scanning electon microscope (SEM) is able to image the surfaces of a wide variety of non-conducting materials due to its variable pressure (VP) mode.
The Nitor 301 Hot Filament Chemical Vapour Deposition (HFCVD), also known as Hot Wire Chemical Vapour Deposition (HWCVD), is used for deposition of intrinsic and doped amorphous and crystalline silicon films. It uses a proprietary hot filament array on a deposition area of up to 300 x 300 mm.
Nitor 301 Hot Filament Chemical Vapour Deposition (HFCVD)